Bonds Dissimilar Materials

A fast cure semi-rigid adhesive for bonding dissimilar materials such as plastics to glass and metals, including acrylic and polycarbonate.

High Chemical Resistance

Superior chemical resistance for moisture and oil, acids and bases in continuous full submersion. High tensile and shear in a rugged flexible system.

Easy Use

Two part, primerless, flexible epoxy, ambient and thermal cure. Low HAZMAT impact. Available in handheld and pneumatic gun actuated cartridges, gallons and drums.

Harsh Environments

Marine,
Civil Engineering,
Downhole oil,
Underwater,

Electronic,
Mining,
Automotive,
Industrial.

Description

BONDiT™ B-52 is a two-part, state-of-the-art 100% solids, elevated-temperature fast curing, semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding engineering plastics and elastomers to various substrates - particularly rigid substrates such as glass, metals and ceramic, without stress build up or joing or substrate fracture.

BONDiT™ B-52 handles harsh environments easily and is particularly effective against moisture, salt water, acids, alkalies, oils, and detergents. B-52 offers good corrosion resistance. B-52 has good thermal stability -- at elevated tempertaures of 200°F, the B-52 becomes rubbery and provides superior accomodation of wide thermal expansion excursions characteristic of dissimilar material bonding. The flexible properties of B-52 permit assembly of materials with dissimilar thermal expansion and survive thermal cycling. Likewise mechanical vibration, shock and impact are easily absorbed by B-52 and it protects surfaces, bonded assemblies and encapsulated sensitive electronics.

BONDiT™ B-52 is also available in silicate filled and thixotropic form, or B-521 which is a unique epoxy system having a dual glass transition temperature: at higher temperatures of 200°F the system cures in seconds to a rubbery state - a flexible solid. On coolilng, it transitions into a semi-rigid state, providing high strength with a good balance of impact and shock resistance and enough flexibility to handle thermal cycle. Hence, both B-52 and B-521 offer rapid cures between glass and plastic, and on cool down joint stresseas are released to produce a structural stress free bond between dissimilar materials in minutes. Stress free potting for electronics - fast cure is obtained at low temperatures suitable for electronics. Eliminates warping and fractures in assemblies. Excellent for autoclave applications of composite laminates with long pot life for assembly and cure in seconds with a flexible bond line. Examples of applications are assembly of glass to acrylic and polycarbonate lighting fixtures, consumer electronics potting and military components exposed to harsh environments.