Bonds Dissimilar Materials

A 40 minute ambient cure high strength semi-flexible adhesive for bonding dissimilar materials such as plastics to glass including acrylic, polycarbonate.

(See B-536 for 10 minute cure version).

High Chemical Resistance

Superior chemical resistance, high strength, even at ambient cure. High thermal stability in a rugged flexible system.

Easy Use

Two part, primerless, epoxy, ambient cure. Very low HAZMAT impact. Available in handheld and pneumatic gun actuated cartridges, quarts, gallons and drums.

Harsh Environments

Marine,
Civil Engineering,
Downhole oil,
Underwater,

Electronic,
Mining,
Automotive,
Industrial.

Description

BONDiT™ B-575 is a two-part, state-of-the-art 100% solids, room-temperature curing, semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding engineering plastics and metals, glass and ceramic. Bondable plastics include the polyolefins.

BONDiT™ B-575 handles harsh environments easily and is particularly effective against moisture, salt water, acids, alkalies, oils, and detergents.
BONDiT™ B-575 has high thermal stability, and offers good corrosion resistance. The semi-flexible properties of B-575 permit assembly of materials with dissimilar thermal expansion and survive thermal cycling. Likewise mechanical vibration, shock and impact are easily absorbed by B-575 while protecting surfaces, bonded assemblies and encapsuled electronics.

B-575 is unfilled and low viscosity, while B-575TH is silicate filed and thixotropic, meaning a thick coating on vertical surfaces will not sag, but it is still easily poured from a can. Apply B-575 by roller or brush.
B-575 is very easy to use with low HAZMAT impact as a 100% solids epoxy system - no plasticizers that bloom to the surface and no solvents causing VOC problems. B-575 in the unfilled version is most useful for potting and clear coating applications to replace urethanes while the filled version, B-575TH is most useful as an adhesive.