BONDiT™ B-755 &
B-755TH
*

Clear Coating, Sealant and Adhesive System


Coating
&
Potting


A unique fast set, low viscosity, ambient cure, water-white, scratch resistant UV resistant epoxy for clear-coatings of many surfaces, conformal coat of electronics, electrical component encapsulation and potting with excellent ambient cure properties

High Performance

High temperature to 600 °F, excellent chemical resistance, high strength even with ambient cure. rugged semi-rigid system. The product is also available in the filled (thixotropic). Bonds to many substrates such as GRE circuit boards and FKM elastomer

 

Easy
to
Use

Two-part, primerless, ambient cure system with very low HAZMAT impact for work environment. Available in handheld and pneumatic gun actuated cartridges, quarts, gallons and drums


Harsh Environments

Marine
Civil Engineering
Downhole oil
Underwater

 

Electronic
Mining
Automotive
Industrial

 

Description

BONDiTTM B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.

BONDiT B-755 exhibits superior thermal resistance compared to most epoxy systems, particularly those offering ambient curing temperature. DMA testing demonstrate stability to 600°F. Excellent for fuel cell applications.

 

 

Mixing
Curing
and
Storage

Apply B-755 by static mixer, brush or roller. B-755 is very easy to use with low HAZMAT impact as a 100% solids epoxy system–no solvents or VOC problems.

Ambient cure (10 gram mix): 60 minute pot life; 90 minute gel time, 2 hours set time, 7 hours to 85% cure, dust free and may be roughly handled. Thin film ambient set time of 90 minutes and cure of 5 hours. Thermal cure at 135degF is approximately 10 minute. In 100gr quantity B-755 is exothermic which will shorten pot life. Mix part A with part B, 4:1 ratio by volume or 100/23.1 by weight. Thoroughly hand mix at least 4 minutes, or use static mixer. Degass is recommended. Optional surface prep will improve adhesion by abrading or grit blasting substrates with #100 AlOx followed by degrease and/or alcohol wipe.

The usable shelf life of unopened containers of BONDiT B-755 resin is one year, and should be stored in cool, dry place. When not in use, containers should be kept tightly closed.Not UV sensitive, but keep away from excess heat.

BONDiT B-755 is available in side-by-side handheld and pneumatic actuated gun cartridges, quarts, gallons, pails and drums.

 

 

Typical Properties

Property
Color Clear water white
Viscosity ~500 cps
 
   
   
RELTEK LLC
2345 Circadian Way
Santa Rosa, CA 95407

Tel  (707) 284-8808
Fax (707) 284-8812

reltek@reltekllc.com