Anticorrosion and Chemical Attack

A protective coat for most metal, glass and ceramic materials for use against corrosion and other chemical attacks. Useful against fungi growth.

Bonds Dissimilar Materials

A hotmelt tie coating on metals, glass and ceramics, for adhesion of thermoset, thermoplastics, rubbers and urethanes. Superior at adhesion of dissimilar and immiscible polymers, UHMW, PE, ETFE, PEI, urethanes, polimids, EPDM, neoprene and many others.

Encapsulates and Seals

Operational temperatures up to 70 deg. C. High dielectric, low permeation, tough and flexible. Excellent for sealing highly sensitive electronics from harsh environments

Harsh Environments

Marine,
Industrial,
Downhole oil,
Underwater,

Electronic,
Mining,
Automotive,
Medical.

Description

BONDiT™ HM-502 is a thermoplastic emulsion system. This product used in conjunction with BONDiT™ A-3 or A-43 affords excellent corrosion protection for metal surfaces, especially in moisture laden environments. BONDiT™ A-3/HM-502 to metal is particularly effective against moisture, salt water, acids, alkalies, solvents, detergents, oils, and dust. Very low permeation and high dielectric qualities together with wide ranging adhesion characteristics make it particularly valuabel in sealing sensitive electronic components and assemblies.

An important feature of this system is the unique bonding capabilities. When used with BONDiT™ A-X and C-X products unusually immiscible polymers may be cohesively bonded: polyolefin to urethane and UHMW PE to epoxy and Tefzel to urethane for example. The benefits of UHMW PE may be combined with the benefits of urethane. Similarly, polymers normally considered non-bonding, or difficult to bond for survival in harsh environments may be adhesively or cohesively bonded: PEI to PEI, PEEK to PEEK, UHMW PE or crosslinked PE to non-polar LDPE.

BONDiT™ HM-502, when used with BONDiT™ A-43, may be cohesively bonded to Tefzel wire insulation for waterproof termination in electrical connectors exposed to moisture. The connector may be further sealed with BONDiT™ B-482 as the connecor backfill, which bonds to the BONDiT™ HM-502. Typical connector to cable overmold boot materials will then bond to BONDiT™ B-482, such as urethanes, high temperature and pressure elastomeric molding, and thermoplastics molding.

With excellent dielectric and extremely low permeation properties, BONDiT™ HM-502 may be used as an electrical encapsulant. Electronic components may be sealed from moisture, such that low voltage leakage currents may be held to the nano-amperes range in components fully submerged in the ocean environment.

The product in liquid form can be poured, sprayed or brushed. BONDiT™ HM-502 is a water-based emulsion but is also available in solid thermoplastic form. Pigments may be added for coloration.

A wide range of curing regimes may be employed. Examples include 160°C (320°F) for 3 minutes, followed by 230°C (446°F) for 5 minutes for thick films. Typical low temperature cure at 121°C (250°F) for 15 minutes. At room temperature, a thin film of BONDiT™ HM-502 will set up in 30-60 minutes. Low temperature cure of thicker films (greater than 0.01 inches) is not recommended.

Uniquely, for non-conducting parts, initial cure may be accelerated with a microwave oven, followed by a heat cycle.

Films of .0005 to .003 inches may be rapidly cured when sprayed or rolled onto hot 290°C (554°F) surfaces.

Heavy coatings of 0.060 inches may be obtained using long cycles of oven cure at 160°C (320°F). In general, excellent results are obtained with 100°C (212°F) for 30 minutes for applications.

The cured coating has an unlimited shelf life. It may be reheated and to the tack ppint and bonded to the substrate. The bonded assembly may be disassembled in the same mannerand reassembled multiple times.

The useable shelf life of the unopened containers of BONDiT™ HM-502 is six months, and should be stored in cooler temperature but always above freezing. When not in use, containers should be kept tightly closed.

BONDiT™ HM-502 is an off-the-shelf product, available in bulk containers and custom packaging.