technology today allows companies to bond ceramics
to dissimilar materials for use in a variety
of applications which were not possible ten years ago. Prior
to the development of this modern bonding system, bonding
ceramics to metals or other substrates with
differing coefficients of expansion ("COE") was
not generally successful. Either the adhesive would fail
substrate. Frequently, the bond would fail later under caustic,
high heat or high wear applications. Many applications today,
particularly those where the bond must
the use of these exact substrates, making the choice of adhesive
critical to success.
Bonding ceramics to other dissimilar materials
requires careful preparation and BONDiTTM
brand adhesives and primers manufactured by RELTEK LLC. BONDiTTM
the few available that can be used to bond these substrates to
other materials for harsh environments and long term
deployment without debonding.
highest recommendation for bonding ceramic to other
substrates, especially polyethylene, is the use of our BONDiTTM B-45TH
which provides a range of capabilities in bonding to other
ceramics, glass, metal, rubber, concrete and urethane, as
well as difficult
to bond polymer substrates such as ultra-high molecular weight
polyethylene (UHMW PE). The product withstands 130% elongation
and easily handles the thermal expansion differential between
glass and polymers.
If fast cure is required, we recommend BONDITTM
instead. BONDiTTM B-536
is frequently used to bond parts for electrical lighting fixtures
where high production through-put
recommend using BONDiTTM B-52
when bonding polycarbonate to glass which will withstand a fast cure
at elevated temperatures. Typical rigid epoxies will fracture the glass
on cooling. BONDiTTM B-52 compensates for the
rapid thermal variation, it's flexible and adapts to
the changes in thermal dimension at higher temperatures, and then it
and holds the part solidly together as it cools down.
The BONDiTTM B-536 and the B-45 products also
allow light transmission, and can therefore be used to bond ceramic
to acrylic or polyacrylic in applications that require an unobstructed
BONDiT A-3 can be used to bond ceramic
parts with very thin, optically clear bond lines providing very high
bond strengths in high-temperature applications (up to 250°C/482°
F) and remains optically
clear over time.
BONDiT A-46 can be used as a sealant for porous ceramics,
as well as to bond ceramics to glass or metal substrates.
The sealant fills in the
micropores without affecting the appearance of the ceramic, it can
be used in very thin bond lines (1/2 to 1 mil), and it
can withstand termperatures
of up to 175°C
Among the other substrates which ceramics and glass can be bonded
to using BONDiTTM products
Delrin, fluoropolymers, rubber, polyethylene, polyolefin, polypropylene,
polyurethane, silicone, thermoplastics,
thermoset, urethane, glass, other ceramic substrates, wood, metals,
stone, aggregate and concrete.
All of the BONDiTTM products can be produced in various formats, including
thixotropic (TH) versions where vertical application without sagging
is needed, caulking compounds, customized cure rates, etc.
call (707) 284-8808 or email email@example.com for
assistance in selecting a BONDiTTM product
that matches your substrate,
production process, strength and harsh environmental requirements.