are engineered plastics that have the property of
becoming hard and rigid when cured and are moldable when
heated. Thermoplastics soften or fuse when heated and harden
and become rigid again when cooled without undergoing any
appreciable chemical change. Phenol resins and plastics were
the original synthetic thermosetting materials. Thermoplastics
can come in many different chemical formulae giving them
different chemical properties and in varying thicknesses
which affect their coefficient of expansion. Successful long
term bonding of thermoplastics to themselves and to other
substrates, requires careful preparation and matching of
the adhesive being used with the differing COEs of the substrates
involved. BONDiTTM products are
among the few available that can be used to bond themoplatics
to substrates with differing COE's for harsh environments
and long term deployment without debonding.
Our first recommended product for bonding thermoplastics is to apply BONDiTTM B-45
after applying an adhesion promoter such as BONDiTTM A-43
Our recommendation would change if high moisture resistance is required, in
which case we would substitute BONDiTTM A-3 as the
When molding with thermoplastic urethane (TPU), BONDiTTM A-43
can be used as an adhesion promoter.
Among the other substrates which thermoplastics be bonded to using BONDiTTM products
are: UHMW, Delrin, fluoropolymers, polyethylene, polyolefin,
polypropylene, polyurethane, silicone, rubber, urethane, other thermoplastics,
ceramics, glass, fiberglass, wood, metals, stone, aggregate and concrete.
See also our discussion of Thermo
Plastic Injection Molding Procedures for Cohesive Bonds.
our chart showing elongation rankings of the various BONDiTTM products click
here. Call or email us for advice on for COE ratings
and matching BONDiTTM products
for your application at (707) 284-8808 or firstname.lastname@example.org.