UHMW ADHESIVES

Ultra high molecular weight polyethylene (UHMW) is a tough wear-resistant plastic with low coefficient of friction, outstanding impact strength with excellent chemical and moisture resistance and broad temperature range. It is most frequently used in conveyor and bulk material handling applications.

One of the properties of UHMW that makes it difficult to bond to is the result of the manufacturing process. UHMW CAN be bonded to itself and to other substrates but it requires careful preparation and BONDiT^TM brand adhesives manufactured by RELTEK LLC. BONDiT^TM products are among the few available that can be used to bond UHWM to itself or other substrates with differing coefficients of expansion (COE). BONDiT^TM products are renowned for their resistance to harsh environments and for withstanding long term deployment without debonding.

Our first product recommendation for bonding UHMW is BONDiT^TM B-45 or BONDiT^TM B-482.

Our recommendation would change if you are overmolding or if there are other special adhesive needs.

If overmolding, we would recommend priming the substrate with our BONDiT^TM A-43 prior to using the B-45 or the B-482.

Or, if exceptional chemical resistance is desired, we would recommend the BONDiT^TM B-481 or B-4811.

Among the other substrates which UHMW can be bonded to using BONDiT^TM products are: Delrin, fluoropolymers, rubber, polyethylene, polyolefin, polypropylene, polyurethane, silicone, thermoplastics, thermoset, urethane, glass, ceramics, wood, metals, stone, aggregate and concrete.

Corona or flame etch is occasionally used to prepare the edges of a proposed bond to strengthen the bond and reduce the incidence of surface chemical bloom, resulting from the manufacturing process to make UHMW. The need to pretreat the UHMW by etching occurs about 15% of the time. If you think that your application may require this treatment, please call (707) 284-8808 or email us for advice as this technique requires some skill and experience.