Thermoplastics are engineered plastics that have the property of becoming hard and rigid when cured and are moldable when heated. Thermoplastics soften or fuse when heated and harden and become rigid again when cooled without undergoing any appreciable chemical change. Phenol resins and plastics were the original synthetic thermosetting materials. Thermoplastics can come in many different chemical formulae giving them different chemical properties and in varying thicknesses which affect their coefficient of expansion. Successful long term bonding of thermoplastics to themselves and to other substrates, requires careful preparation and matching of the adhesive being used with the differing COEs of the substrates involved. BONDiT^TM products are among the few available that can be used to bond themoplatics to substrates with differing COE's for harsh environments and long term deployment without debonding.

Our first recommended product for bonding thermoplastics is to apply BONDiT^TM B-45 after applying an adhesion promoter such as BONDiT^TM A-43 or C-6.

Our recommendation would change if high moisture resistance is required, in which case we would substitute BONDiT^TM A-3 as the adhesion promoter.

When molding with thermoplastic urethane (TPU), BONDiT^TM A-43 can be used as an adhesion promoter.

Among the other substrates which thermoplastics be bonded to using BONDiT^TM products are: UHMW, Delrin, fluoropolymers, polyethylene, polyolefin, polypropylene, polyurethane, silicone, rubber, urethane, other thermoplastics, ceramics, glass, fiberglass, wood, metals, stone, aggregate and concrete.

See also our discussion of Thermo Plastic Injection Molding Procedures for Cohesive Bonds.

To see our chart showing elongation rankings of the various BONDiT^TM products click here. Call or email us for advice on for COE ratings and matching BONDiT^TM products for your application at (707) 284-8808 or reltek@reltekllc.com.