Polypropylene is a themoplastic, that is, it is one of a variety of materials that have the property of becoming hard and rigid when cooled and are moldable when heated. Polypropylenes soften or fuse when heated and harden and become rigid again when cooled without undergoing any appreciable chemical change. Polypropylenes come in many different chemical formulae (due to additives) which give differing chemical and mechanical properties, including adhesion, and in various thicknesses -- both of which affect coefficient of expansion (COE). Successful long term bonding of polypropylene to itself and to other substrates, requires careful preparation and matching of the adhesive being used with the differing COEs of the substrates involved. BONDiT^TM products are among the few available that can be used to bond polypropylene to substrates with other COE's for harsh environments and long term deployment without debonding.

Our highest recommended product for bonding polypropylenes is BONDiT^TM B-45TH or B-482TH or B-4682, depending upon the relative need for chemical resistance, bond strength, impact and vibration resistance, heat resistance and COE differential.

Our recommendation would change if a fast cure is needed, in which case we recommend BONDiT^TM B-536TH.

Among the other substrates to which polypropylene can be bonded using BONDiT^TM products are: UHMW, Delrin, fluoropolymers, rubber, polyethylene, polyolefin, polyurethane, silicone, thermoplastics, thermoset, urethane, ceramics, glass, fiberglass, wood, metals, stone, aggregate and concrete.

To see our chart showing rankings by property, including elongation, of the various BONDiT^TM products click here. Call or email us for advice on for COE ratings and matching BONDiT^TM products for your application at (707) 284-8808 or reltek@reltekllc.com.